简介:Theliquid-filmsolution-diffusionbondingofZCuBe2.5alloyswasconductedusingCu-basedalloypowders.Thetensilestrengthofthebondingtimedecreasesandtheinterfacemigrationvelocityincreasesbondingtime,thethicknessofdiffusionlayerincreaseswiththeincreaseoftemperaturegradient,andthistendencybecomesmoreremarkablewiththeprolongingofbondingtime.