BondingofAl2O3tocuisperformeddirectlyusingTifoilattemperatureof1273K.Themicrostructureofthejointinterfaceisinuestigatedthroughscanningelectronmicroscope（SEM）,electron.probemicroanalysis（EPMA）andX-raydiffraction（XRD）.theeffectoftheinitialtifoilthicknessonthereactionlayerthicknessandthejointStrengthareinvestigated.
中国焊接：英文版
1998年1期
