摘要
3DStackedPackagesWithBumplessInterconnectTechnology;?AActivebrazingalloyproducedbyelectrolessplatingtechnique;Additionaleffectofelectrolessplatingfihn(dampingcapacityimprovelnent;Adsorbatesformedonnon-conductingsubstratesbytwo-stepcatalyzationpretreatmentforelectrolessplating;DepositionofThrough-HoleMetalFihnOllGlasswithElectrolessPlating
出版日期
2005年02月12日(中国期刊网平台首次上网日期,不代表论文的发表时间)