简介:1.IntroductionTheEMCdesignforthePrintedCircuitBoardhasbeenapopulartopic.Guidelinesandtipsforhigh-speedPCBdesignscouldbefoundfromnumerousresources.WheninvestigatingEMIissuesassociatedwithcircuitboards,manydetailssuchasclockfrequencies,switchingrates,rise/falltimes,signalharmonics,datatransferrates,impedances,traceloading,andtypesandvaluesofthevariouscircuitcomponents,shouldbetakenintoconsiderations.ThephysicallayoutofthePCboardanditsassociatedmetalliccomponentsareimportantconsiderations.Specialattentionshouldbegiventotheplacementandcharacteristicsofsignalsourcecomponents,vias,
简介:本文中介绍了物联网的特点及其相关电子产品对PCB基板材料的要求、目前市场上可供选用基板材料的品种、规格及其主要性能等情况。