简介：Theliquid-filmsolution-diffusionbondingofZCuBe2.5alloyswasconductedusingCu-basedalloypowders.Thetensilestrengthofthebondingtimedecreasesandtheinterfacemigrationvelocityincreasesbondingtime,thethicknessofdiffusionlayerincreaseswiththeincreaseoftemperaturegradient,andthistendencybecomesmoreremarkablewiththeprolongingofbondingtime.
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