简介：Inthiswork,thewettability,agingandshearpropertiesofanewtypeoflead-freesolderpasteSn-07Ag-05Cu+BiNi(SACBN07)wasinvestigatedbyconductingaseriesofcomparisonexperimentswithSAC305andSAC0307solderpaste.TheresultsshowthatwettabilityofSACBN07isalmostequaltoSAC305,andbetterthanthatofSAC0307solderpaste.Thethicknessofintermetalliccompound(IMC)layerinSACBN07/Cuislowerthanthatofothertwotypesofsolderjointafteraging.AndCu_3SnlayerofSACBN07/CuisthinnerthanthatofSAC305andSAC0307.Inaddition,theSACBN07solderjointsperformthebestshearstrengthamongthesethreetypesofsolderpastes.
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