摘要
Thethermalstressofthequartzoscillatormodulepackagingisinvestigatedusingdistal-im-agecorrelationmethod(DICM),andtheexperimentalresultsaregiven.Underthequartzoscillatormodulepackaging,thequartzoscillatorandtheFe-Sn-Cualloyframearejoinedtogetherwiththeelectroconductiveadhesive(PI),andtheelectroconductiveadhesiveneedstobecuredtwiceat150℃and275℃respective-ly.AsthequartzoscillatorandtheFe-Sn-Cualloyframehaveadistinctdifferenceinboththermalexpansioncoefficientsandmechanicalpropertiesandinprocessofpackagingtemperaturerisesordrops,thethermalstressisyieldedeasily.Whiletemperaluredrops,thenormalstressatthequartzoscillatoredgeisatensilestress,whichcanmakethequartzoscillatorfracture.
出版日期
2001年03月13日(中国期刊网平台首次上网日期,不代表论文的发表时间)