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2012年2期
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Correlating solder interconnects failure with PCBs response during board level drop impact test
Correlating solder interconnects failure with PCBs response during board level drop impact test
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摘要
未填写
DOI
6jry59y5d5/1154963
作者
刘洋;孙凤莲
机构地区
不详
出处
《中国焊接:英文版》
2012年2期
关键词
跌落冲击试验
印刷电路板
反应板
焊接
试验过程
互连
分类
[金属学及工艺][焊接]
出版日期
2012年02月12日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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来源期刊
中国焊接:英文版
2012年2期
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相关关键词
跌落冲击试验
印刷电路板
反应板
焊接
试验过程
互连
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